This webinar will showcase the design, analysis, and optimization of a multi-die fabric architecture based on the next generation Arm® CoreLink™ CMN-700 interconnect, a high-performance cache coherent interconnect solution designed for complex multi-die system-on-chip (SoC), such as those found in data centers.

In this webinar, you will learn about the latest trends in 1.6T Ethernet, when you can expect this standard, and the deployment challenges.

Attend this webinar series to find out about some of the essential requirements that can help you overcome multi-die system challenges and make your move to multi-die systems successful.

This 30-minute Webinar aims to show chip designers how they can best ensure secure data is handled correctly inside the chip while reducing deployment time.